SEMICONDUCTOR
Ralsonics is a leading provider of advanced ultrasonic cleaning technologies designed specifically for the semiconductor industry. With decades of engineering expertise, Ralsonics delivers highly precise, contamination-free, and ultra-reliable cleaning solutions that meet the demanding standards of wafer fabs, chip manufacturers, and electronics assembly units.
Our ultrasonic systems ensure unmatched particle removal, enhanced yield, and superior surface preparation for every stage of semiconductor manufacturing.
Semiconductor Industry
The semiconductor industry is a critical sector that forms the backbone of modern technology. It encompasses the design, fabrication, and distribution of semiconductor devices, which are essential components in electronic circuits. Semiconductors are materials that possess unique electrical properties, allowing them to control the flow of electricity. This capability enables semiconductors to perform various functions such as amplification, switching, and storage of electrical signals.
The semiconductor industry drives innovation and powers advancements in a wide range of sectors, including information technology, telecommunications, automotive, healthcare, and consumer electronics. Semiconductors are used in microprocessors, memory chips, sensors, transistors, and integrated circuits that form the core of electronic devices. The industry is characterized by intense research and development activities to improve performance, reduce size, increase efficiency, and lower costs.
Ultrasonic cleaning is considered the ideal cleaning method for semiconductors due to several key reasons. Semiconductors are highly sensitive electronic components that require gentle yet effective cleaning to ensure their optimal performance. Ultrasonic cleaning achieves this balance by using high-frequency sound waves to generate microscopic bubbles in a cleaning solution. These bubbles implode near the semiconductor’s surface, creating a scrubbing action that dislodges contaminants without causing damage.
Why Ultrasonic Cleaning for Semiconductors?
Ultrasonic cleaning uses high-frequency sound waves, typically 40 kHz to 1 MHz, to generate microscopic cavitation bubbles in a cleaning medium.
When these bubbles collapse, they:
Remove sub-micron particles
Dislodge embedded contaminants
Clean complex geometries without abrasion
Restore precision surfaces with uniformity and repeatability
Megasonic (700 kHz – 1 MHz) cleaning is especially used for wafer-level contamination control, as it provides gentle yet highly effective particle removal.
Benefits of Ultrasonic Cleaning in Semiconductor Manufacturing
Sub-Micron Cleaning Accuracy
Removes particles smaller than 0.1 µm that traditional cleaning cannot reach.
Non-Contact & Damage-Free
No scratching, mechanical stress, or pattern damage.
High Repeatability for Fabs
Consistent quality essential for high-volume production.
Suitable for Fragile Materials
Ideal for thin wafers, MEMS structures, and advanced substrates.
Reduced Use of Harsh Chemicals
Eco-friendly and cost-effective processing.
Improved Yield & Device Reliability
Lower defect density and better product performance.
Faster Process Cycles
Shorter cleaning times compared to manual or spray-based methods.
Advanced Ultrasonic Cleaning in Semiconductor Industry
Here is a short list of parts that are typically cleaned using Ralsonics’ ultrasonic cleaners
Integrated circuits (ICs)
Transistors
Diodes
Microchips
Printed Circuit Boards (PCBs)
Capacitors
Resistors
Inductors
Switches
Relays
Fuses
Memory modules (RAM, ROM)
FAQ
Ultrasonic (40–200 kHz) provides aggressive cleaning for tough contaminants. Megasonic (700 kHz–1 MHz) is gentle and ideal for wafer & MEMS cleaning where micro-damage must be avoided.
No, when operated at high frequencies (typically 700 kHz+), cavitation becomes gentle and controlled, ensuring zero wafer damage.
Mainly DI water, mild detergents, and semiconductor-grade cleaning solutions depending on the process.












